柔性电路板工艺参数
|
序号 |
内容 |
常规参数 |
特殊参数 |
|
1 |
层数 |
1～8层 |
10层 |
|
NO.OF LAYER |
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2 |
完成板尺寸(最大) |
250*650mm |
OK |
|
FINISHED BOARD SIAE (MAX) |
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|
3 |
完成板尺寸(最小) |
10mm*15mm |
OK |
|
FINISHED BOARD SIAE (MIN) |
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|
4 |
软板厚度(最大) |
16 mil (0. 65mm) |
100 mil （2.5mm） |
|
BOARD THICKNESS (MAX) |
软硬结合板 |
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|
5 |
软板厚度(最小) |
3 mil (0.075mm) |
（防焊）2mil(0.05mm) |
|
BOARD THICKNESS (MIN) |
多层板5 mil (0.12mm) |
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|
6 |
成品厚度公差(0.085mm≦板厚<0. 65mm) |
±2mil(±0.05m) |
OK |
|
FINESHED BOARD THICKNESS FOLERANCE |
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|
(0.085MM≦BOARD THICKNESS<0.65mm) |
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|
7 |
钻孔孔径(最大) |
240 mil (6.0mm) |
260 mil （6.5mm） |
|
DRILL HOLE DIAMETER (MAX) |
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|
8 |
钻孔孔径(最小) |
8 mil (0.2mm) |
6 mil （0.15mm） |
|
DRILL HOLE DIAMETER (MIN) |
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9 |
完成孔径(最小) For machine drill |
6 mil (0.15mm) |
4 mil （0.10mm） |
|
FINESHED VIA DIAMETER (MIN) |
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|
10 |
孔电镀纵横比(最大) |
5:01 |
OK |
|
HOLE PLATING ASPECT RATIO (MAX) |
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|
11 |
孔径公差(镀通孔) |
±3mil(±0.076 mm) |
OK |
|
HOLE DIAMETER TOLERANCE (PTH) |
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|
12 |
钻孔孔径公差(非镀通孔) |
±2mil(±0.050mm) |
OK |
|
HOLE DIAMETER TOLERANCG (NPTH) |
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|
13 |
孔位公差(与CAD数相比) |
±3mil(±0.076mm) |
±0.04mm |
|
HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA) |
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|
14 |
PTH孔孔壁铜厚 |
≧0.4mil(≧10um) |
≧7.0um |
|
PTH HOLE COPPER THICKNESS |
≦1.0mil(≦25 um) |
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|
15 |
外形精度 |
±4 mil（±0.1mm） |
±2 mil |
|
（±0.05mm） |
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|
16 |
底铜厚度(最小) |
1/3OZ(12um) |
1/4 OZ |
|
OUTER LAYER BASE COPPER THICKNESS (MIN) |
（9um） |
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|
17 |
底铜厚度(最大) |
2OZ(70um) |
3OZ |
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OUTER LAYER BASE COPPER THICKNESS (MAX) |
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|
18 |
绝缘层厚度(最小) |
0.0125mm(PI厚1/2mil) |
OK |
|
INNER LAYER DIELECTRIC THICKNESS (MIN) |
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|
19 |
绝缘层厚度(最大) |
0. 50mm(PI厚2mil) |
OK |
|
INNER LAYER DIELECTRIC THICKNESS (MAX) |
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|
20 |
材料类型 |
PI聚酰亚胺/PET聚脂 |
无胶基材 |
|
BASE.MATERIAL |
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21 |
设计线宽/间距 (最小) LAVER DESIGN LINE WIDTH/SPACING (MIN) |
双面板及多层板1*2OZ 3.5mil/3.5mil(0.08mm/0.08mm) |
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|
单面板1/2OZ 2.5mil/2.5mil(0.06mm*0.06mm) |
特殊： |
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|
双面板及多层板1 OZ |
双面板1/4OZ |
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|
5mil/5mil(0.12mm*0.12mm) |
(0.045mm*0.045mm) |
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单面板1 OZ |
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3mil/3mil(0.075mm*0.075mm) |
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双面板1/3OZ/ 1/4OZ 2mil/2mil(0.05mm*0.05mm) |
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|
22 |
蚀刻公差 TOLERANCE AFTER ETCHING |
≦±20%(一般) |
±15% |
|
for(impedance) |
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|
23 |
图形对图形精度 (最小) |
±4mil(±0.1mm) |
±2mil |
|
IMAGE TO IMAGE TOLERANCE (MIN) |
(0.05mm) |
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|
24 |
图形对板边精度(最小) |
±4mil(±0.1mm) |
OK |
|
IMAGE TO EDGE TOLERANCE (MIN) |
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|
25 |
多层板内层最小PAD |
≧6mil（≧0.15 mm） |
OK |
|
26 |
文字对位精度公差LEGEND MASK REGISTRATION(MIN) |
±12mil(±0.3mm) |
±6mil |
|
(±0.15mm) |
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|
27 |
防焊对位精度公差SOLDERMASK REGISTRATION(MIN) |
±4mil(±0.1mm) |
±2mil |
|
(±0.05mm) |
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|
28 |
防焊厚度(最小)SOLDERMASK THICKNESS (MIN) |
0.4mi l(10um) |
OK |
|
29 |
防焊焊盘开窗公差/焊盘与焊盘位置公差 |
±2mil(0.05mm) |
OK |
|
30 |
CVL开窗焊盘公差/焊盘与焊盘公差 |
±4mil(±0.1mm) |
±3mil |
|
(±0.076 mm) |
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|
31 |
CVL对位精度贴合公差/CVL 最小开方孔REGISTRATION(MIN) |
±4mil (±0.1mm)/ 0.5mm |
±0.1mm |
|
32 |
CVL压合溢胶量(MIN) |
2mil-6mil (0.05-0.15mm) |
OK |
|
33 |
锡厚(最大),(最小) (plating) |
2.5-7.5um |
OK |
|
SOLDER TIN LEAD THICKNESS ON FINGER OR PAD.(MAX) (MIN) |
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|
34 |
金手指镀镍厚度及公差(plating) |
1-6um |
OK |
|
GOLD FINGER NICKEL THICKNESS (MAX) TOLEARANCE THICKNESS |
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|
35 |
金手指镀金厚度及公差(plating) |
(0.01-0.09um) /(0.03-0.05um) |
厚金1-2um |
|
GOLD FINGER AU THICKNESS (MAX) TOLEARANCE THICKNESS |
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|
36 |
沉镍厚/金厚(最薄点)(最大) |
0.08-0.12 mil /0.0004-0.003 mil |
OK |
|
NICKEL THICKNESS FOR ELECTROLESS NICKEL AND INMERSION GOLD(MEASLRED AT THE MINTMUM POINT)(MAX) |
（2-3um/0.01-0.075um） |
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|
37 |
冲孔孔径(min-max),孔径公差,精准度 |
30-240 mil（0.8-6.0mm）±0.05mm |
OK |
|
PUNCHING HOLE (MIN-MAX) DIAMETER TOLERANCE |
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|
38 |
贴合补强板及胶对位公差( THE TOLERANCE OF PASTEING ADHESIVE AND STIFFER) |
±8mil (±0.2um) |
±0.1mm |
|
39 |
冲外形公差(边到边)(钢模) |
±4mil(±0.1mm) |
±2mil |
|
PUNCHING DIE DIMENSION TOLERANCE (EDGE TO EDGE)(STEEL DIE) |
多层板为±6mil(±0.15mm) |
(±0.05mm) |
|
|
40 |
冲外形公差(边到边)(刀模) |
±12mil(±0.3mm) |
±8mil |
|
PUNCHING DIMENSION TOLERANCE (EDGE TO EDGE) |
(±0.2mm) |
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|
41 |
冲外形公差(简易模) |
±6mil(±0.15mm) |
OK |
|
PUNCHING DIMENSION TOLERANCE |
|||
|
42 |
成品板阻抗公差(最小) |
±15% |
OK |
|
TMPEDANCE TOLERANCE (MIN) |
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|
43 |
通断路测试电压 E-TEST VOLTAGE |
200-250V |
OK |
|
44 |
短路电阻 ISOLATION RESISTANCE |
10MΩ |
OK |
|
45 |
开路电阻CONTINUITY RESISTANCE |
50Ω/100Ω |
OK |
|
46 |
焊锡性测试 COPPER SOLDERABILITY TEST |
IPC-TM-650 |
OK |
|
260±5℃,时间5Sec |
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|
47 |
热应力测试 THERMAL STRESS TEST |
IPC-TM-650 |
OK |
|
288±5℃ 时间30sec |
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|
48 |
耐热性 FLAMMABILITY |
IPC-TM-650 |
OK |
|
94V-0 |
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|
49 |
耐电压试验By date code/依产品叠构、材质 |
IPC-TM-650找出FPC两相邻线路， 使用耐电压测试机，电压：500V， 时间：60秒 |
OK |
|
50 |
绝缘阻抗试验By date code/依产品叠构、 材质 |
IPC-TM-650找出FPC两相邻线路， 使用绝缘阻抗测试机， 量测其绝缘阻抗。 |
OK |
|
51 |
高温高湿试验 |
IPC-TM-650FPC放置温度：60℃， 湿度：95%RH处时间：72小时后， 做焊锡性或热应力试验 |
OK |
